SEMICONDUCTOR WAFER COOLING DEVICE Russian patent published in 2002 - IPC

FIELD: microelectronics; lithographic operations in manufacturing semiconductor devices and integrated circuits. SUBSTANCE: device has case with peripheral air chamber communicating with gas or air supply main and with working zone on one of its external sides meant to receive wafer that communicates with air chamber through nozzles; means for varying flowrate of gas or air; control unit; low-pressure sensors connected to means for varying flowrate of air or gas through control unit; nozzles of peripheral air chamber are tilted to center, and central bore communicates with gas or air discharge channel; diameter of central bore is larger than total diameter of all nozzles of peripheral air chamber. EFFECT: enhanced cooling efficiency, reduced cost of device. 3 dwg, 1 tbl