FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electronic equipment and microelectronics and can be used in manufacture of powerful ultra high frequency devices, transistors, power modules and LEDs. In the method for metallisation of aluminium nitride ceramics, including preliminary heat treatment of the ceramics, application of a metallisation paste to the surface of ceramics by the screening method and burning of the paste, additionally, prior to heat treatment, an adhesive layer of suspension with a thickness of 5 to 10 mcm, including alundum, colloxylin, isoamyl acetate, methanol, talc with the following ratio of the components, wt.%: alundum (aluminyum oxide) 33.0 to 34.65; colloxylin 0.60 to 0.80; isoamyl acetate 11.3 to 12.3; methanol 53.3 to 53.7; talc 0.15 to 0.20, is applied onto the ceramics, and heat treatment is conducted in a hydrogen medium at a temperature of 1,500 to 1,600°C. The metallisation paste is produced from the following materials ( wt.%): Mo 80, Mn 15, Si 5, and a mixture containing ethyl cellulose-100, α-terpineol, dibutyl phthalate and oleic acid is used as a binder.
EFFECT: clear topological pattern of metallisation is obtained; adhesion of the metallisation coating to aluminium nitride ceramics is increased by more than 2 times.
4 cl, 2 tbl, 2 ex
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RU2803271C1 |
Authors
Dates
2021-11-11—Published
2020-11-27—Filed