METHOD FOR METALLIZATION OF CERAMIC PRODUCTS Russian patent published in 2022 - IPC C04B41/88 

FIELD: electronic industry.

SUBSTANCE: invention relates to the metallization of ceramics used in electronics, radio engineering and other industries, and can be used for the manufacture of electro-vacuum devices, hybrid integrated circuits and power module housings and high-power semiconductor devices. The essence of the invention consists in the fact that titanium plates are used as a metallization film, which are mounted on both sides to flat ceramic products, pressed, and then the assembled product is heated together with subsequent firing in one cycle in a vacuum furnace at first at a temperature of 400°C for at least 30 minutes, after which it is heated at a temperature of 850°C for at least 12 minutes, and then firing is carried out at a temperature of 960°C for at least 4 minutes. With this firing mode, titanium is sprayed and diffused into the surface layers of ceramic substrates, which ensures a strong metal-ceramic bond. To implement the invention, titanium plates with a thickness of no more than 1.5 mm are used, heating and annealing of which, together with ceramic substrates, are carried out in a fixing mandrel. After firing, the titanium plates are detached from the ceramic substrates. Different metallization structures can be applied to the titanium coating of the substrate by vacuum spraying, electroplating or using a metallization paste.

EFFECT: simplification of the process of obtaining multilayer metallization coatings, increasing the productivity and manufacturability of the metallization process in mass production conditions.

3 cl, 5 ex