FIELD: foundry. SUBSTANCE: proposed backing plate serves to provide quick hardening of melt with formation of band. Backing plate is made from copper-based heat- conducting alloy with microcrystalline or amorphous structure with size of grains within 1 and 1000 μm and homogeneous distribution of grains in all directions. Heat-conducting alloy is essentially beryllium bronze alloy. Method of manufacture of hardening backing plate comes to pouring melt components into mould, mechanical processing of ingot with breaking of grain structure formed at casting and subsequent heat treatment of ingot. Invention provides accelerated hardening for obtaining required microstructure of band produced by casting and eliminates possible mechanical defects on hardening surface leading to distortion of geometric sizes of band. EFFECT: improved quality of backing plate. 10 cl, 4 dwg, 1 ex
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Authors
Dates
2001-10-20—Published
1996-04-23—Filed