FIELD: manufacture of radio electronic devices. SUBSTANCE: wiring board has dielectric base with holes to bring out leads of elements and wires arranged on one side of board and connected to leads of elements on the other side of board. Board has holes for piercing of wires located on one side of board and formation of lands for arrangement of soldered leads by loops of these wires on the other side of board. EFFECT: enhanced reliability of contact connection with simultaneous improvement of density of wiring. 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| CIRCUIT BOARD WITH ELECTRICAL AND OPTICAL INTERCONNECTIONS AND METHOD OF ITS FABRICATION | 2012 |
|
RU2577669C2 |
| SPECIAL CONTACTING DEVICE | 2010 |
|
RU2446643C1 |
| METHOD FOR FORMING THE VOLUME PATTERN OF INTER-CONNECTIONS | 2015 |
|
RU2647879C2 |
| WOVEN CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | 2012 |
|
RU2600037C2 |
| WIRING BOARD | 0 |
|
SU790367A1 |
| CIRCUIT BOARD | 0 |
|
SU1019680A1 |
| 0 |
|
SU541303A1 | |
| WIRING BOARD MANUFACTURING METHOD | 0 |
|
SU869084A1 |
| STRONG MULTILAYER PRINTED BOARD, CONTAINING LOW-CUTTING CONTROL CIRCUITS | 2015 |
|
RU2630680C2 |
| PROCESS FOR MANUFACTURING WIRING BOARDS | 0 |
|
SU1056483A1 |
