FIELD: radio engineering and communications.
SUBSTANCE: invention relates to obtaining a volume topology of conducting and fiber-optic inter-connectors in a tissue, in mesh substrates, in scalable mesh substrates and can be used in electrical, electronic, microelectronic and radio engineering industries, for manufacturing electrical boards, circuit boards and their prototypes. Technical result is achieved by forming a table of connections in accordance with a schematic or wiring diagram. Invention comprises insertion of wire segments, optical fiber at the points of future contacts with the components' outputs in accordance with the table of connections. Ends of the segments are bunched, connected together by welding, soldering, gluing, etc. and isolated. Volume topology of conducting and fiber-optic inter-connector with predominantly rectilinear connections are obtained without making patterns and using lithographic processes.
EFFECT: technical result is creation of a method that makes it easy to produce a volume pattern of maximal density inter-connections with high immunity and electromagnetic compatibility, excluding short circuits and breaks, loops at the ends of segments without using patterns, lithographic processes, drilling of the main holes.
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Authors
Dates
2018-03-21—Published
2015-10-26—Filed