CIRCUIT BOARD WITH ELECTRICAL AND OPTICAL INTERCONNECTIONS AND METHOD OF ITS FABRICATION Russian patent published in 2016 - IPC H05K1/00 H05K1/14 H05K1/18 H05K3/30 

FIELD: electronics.

SUBSTANCE: claimed circuit board comprises a substrate, bond areas, electrical interconnection conductors and optical interconnections composed by optic fibres. Note here that the used substrates are screens. The starts of the conductors or optic fibres are woven in the screen meshes nearby the bond areas or components terminals. The ends of the conductors or optic fibres are interwoven into the sets of closely set screen meshes and interconnected to make the nodes of screens. The claimed procedure uses the screen-like substrates with the increased linear sizes of the cells before interweaving. After interweaving, the linear sizes of the cells are decreased by approximating the cells elements to design sizes.

EFFECT: higher density of circuit density, simplified circuit design, simplified layout and routing, simplified fabrication, higher reliability and lower costs.

2 cl