FIELD: electricity.
SUBSTANCE: method realisation requires application of contact elements installed in a pitch of outputs of a large-scale integration circuit (LIC) (0.5 mm), which do not produce serial standard contacting elements, for instance, elements of GKSE-0.75 type by INGUN company. It is achieved by the fact that two boards are moved relative to each other on guides, a controlled circuit board is based on the first board, and a process circuit board is installed on the second board. On the process circuit board, at the side that is opposite to the controlled circuit board, there is a block unsoldered to install the LIC. On the other side of the process circuit board there are metallised sites 6, connected by printed conductors to leads of the block for LIC installation. Location of these metallised sites corresponds to location of transition metallised holes, which, in their turn, are connected by printed conductors with leads of sites for LIC installation on the controlled circuit board. Contacting elements are fixed in the second board to ensure electric connection between metallised sites of the process circuit board and appropriate transition metallised holes of the controlled circuit board.
EFFECT: connection of a large-scale integration circuit to a circuit board with suspended elements without its unsoldering.
2 dwg
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Authors
Dates
2012-03-27—Published
2010-07-13—Filed