FIELD: electroplating and electroforming, namely processes for applying composition electrochemical gold-base coatings. SUBSTANCE: process comprises steps of electrochemical deposition out of gold- plating electrolyte containing suspension of solid inert particles; using as solid inert particles colloidal cluster diamond particles with size (0.001- 0.120) micrometers taken in quantity (0.1-35) g/l. EFFECT: enhanced wear proofness of coatings applied at small consumption of insoluble in electrolyte ultrafine particles by simplified process. 1 cl, 5 dwg, 6 tbl, 4 ex
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Authors
Dates
2002-10-20—Published
2000-10-05—Filed