FIELD: technological processes.
SUBSTANCE: invention relates to fluxes for copper and copper alloys tinning with low-temperature solders, for example, tin and lead or tin and indium solders, and can be used in production of tinned copper wire, as well as during soldering and tinning of wiring elements, integrated microcircuits, metal surfaces of printed circuit boards and terminals of electric radio elements in household appliances, as well as electrodes, screening elements, photoelectric modules, cable-conductor articles for various purposes. Flux for soldering and tinning copper wire contains citric acid, glycerol and isopropyl alcohol, as well as synthesized aminosiloxane of general formula 
.
EFFECT: technical result consists in increase of activity of flux, improvement of wettability of surface of copper wire, spreading of solder, adhesion of coating with surface of copper wire.
1 cl, 4 tbl
| Title | Year | Author | Number |
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RU2263569C1 |
