FIELD: chip cards with body, semiconductor circuit and substrate, while substrate on both sides is provided with flat contacts and conductors of contact openings, which connect upper and lower flat contacts electrically to each other.
SUBSTANCE: because conductors of contact openings are hollow inside, air moisture can penetrate chip card through hollow gaps and damage semiconductor micro-circuit, of conductors of contact openings are not closed. Method includes positioning conductors of contact openings so close to edge of substrate, that their lower ends project into base of external hollow and close together there.
EFFECT: prevented penetration of moisture into inner hollow, wherein micro-circuit is positioned, without need for special protection of contact opening conductors.
10 cl, 2 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| CONTACTLESS CHIP CARD | 2012 |
|
RU2508991C1 |
| IGNITION DEVICE FOR INITIATION OF DETONATOR WHICH HAVE AT LEAST ONE MAIN CHARGE IN CASING | 1988 |
|
RU2112915C1 |
| METHOD OF ELECTRONIC COMPONENT INSTALLATION ON BASE | 2004 |
|
RU2328840C2 |
| ELECTRONIC CONTACTLESS UNIT FOR CARD OR LABEL | 1997 |
|
RU2194306C2 |
| NEEDLE CARRIER FOR TS SEMICONDUCTOR MICROCIRCUITS | 0 |
|
SU964556A1 |
| METHOD FOR MANUFACTURING LAMINATED CHIP CARDS | 2001 |
|
RU2230362C1 |
| STRUCTURAL MEMBER | 2003 |
|
RU2290718C2 |
| CONTACT ASSEMBLY ON OPPOSITE CONTACTS WITH CAPILLARY CONNECTION ELEMENT, AND MANUFACTURING METHOD THEREOF | 2008 |
|
RU2374793C2 |
| 3D ELECTRONIC DEVICE | 2011 |
|
RU2488913C1 |
| STRAIN GAUGE OF ABSOLUTE PRESSURE BASED ON SOI MICRO-ELECTROMECHANICAL SYSTEM | 2015 |
|
RU2609223C1 |
