FIELD: electronics, cooling of integrated circuits. SUBSTANCE: heat- sink includes heat-conducting plate placed on cooled surface. Thickness of plate gradually increases from edges towards central part in compliance with curvilinear profile concave upwards and thanks to it air stream supplied to plate deviates to its edges assuming in essence horizontal direction across outlet. Heat-conducting plate has aggregate of cooling ribs located on it and passing radially from central part towards edges of plate. EFFECT: design of noiseless heat-sink of small dimensions with high heat abstraction from heat-conducting plate to ambient air. 18 cl, 3 dwg
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