FIELD: procedure of machining of blanks from semiconductor and dielectric materials, applicable for cutting of blanks into plates by diamond cutting wheels with an inner cutting edge. SUBSTANCE: the method includes the delivery of the rotating diamond cutting wheel to the blank, and the lubricant-coolant is fed to the zone of machining and to the non-machined end face of the cut plate. In the process of cutting the position of the plate relative to the plane of cutting is monitored, and the delivery of lubricant-cooler is adjusted proceeding from the condition of minimization of plate deflection from the plane of cutting. EFFECT: enhanced quality of the cut plates. 3 dwg
