FIELD: electronic industry for cutting the plates and substrates into crystals. SUBSTANCE: before cutting a layer of solid lubricant with a thickness of not more than (Lcr-2/3Lp), is preliminarily applied onto the processed surface of the plate, where Lcr - the value of disk overhand from the holder; Lp - thickness of cut plate. EFFECT: reduced width of the saw kerf and dimensions of spallings at the edges of the cut. 2 dwg, 1 tbl, 1 ex
