METHOD FOR SOLDERING OF TELESCOPIC STRUCTURE, MATERIAL OF EXTERNAL PART OF WHICH HAS LINEAR EXPANSION COEFFICIENT THAT EXCEEDS LINEAR EXPANSION COEFFICIENT OF INTERNAL PART Russian patent published in 2009 - IPC B23K1/00 B23K1/19 

FIELD: technological processes.

SUBSTANCE: invention may be used in manufacturing of soldered telescopic structures from heterogeneous materials with various character of their linear expansion coefficients (LEC) variation in process of heating. In process of soldering of structure, external shell of which is made of chromium-nickel alloy, and internal one - of copper, for shells pressing to each other, temperature compensator is used in the form of technological ring. Temperature compensator is installed inside internal shell with tension that creates pressure in it, which is equal to yield point of this shell material at temperature that corresponds to beginning of temperature range of external part material LEC exceeding over LEC of internal part material. Thickness of temperature compensator provides for its resistance to action of internal part.

EFFECT: simplified technological process of structure making and increased yield of good products.

3 cl, 1 ex