FIELD: processes and equipment for making soldered joints used in missile making industry branch, aircraft manufacture, heat and power engineering. SUBSTANCE: structure includes part of dispersion-hardened nickel-base alloy and part of copper-base alloy. Method comprises steps of applying nickel coating onto soldered surfaces of both parts; subjecting part of dispersion hardened alloy to quenching before applying coating onto it; assembling structure while placing copper base solder containing 15 -17% of manganese onto soldered surfaces; heating, soldering structure, cooling and aging it. EFFECT: enhanced reliability of soldered joints. 3 cl, 1 dwg, 1 ex
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