HEAT FLUX SENSOR Russian patent published in 2004 - IPC

Abstract RU 2242728 C2

FIELD: microelectronics and optoelectronics.

SUBSTANCE: proposed sensor has silicon substrate that mounts diaphragm and thermocouples disposed in tandem. Hot and cold junctions of thermocouples are disposed on thin and thick parts of diaphragm. Thermocouples are interconnected to form pile and are made of single-crystalline silicon and aluminum; diaphragm is made of single-crystalline calcium fluoride insulating film.

EFFECT: enhanced sensitivity and manufacturability of device.

1 cl, 1 dwg

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RU 2 242 728 C2

Authors

Velichko A.A.

Iljushin V.A.

Filimonova N.I.

Dates

2004-12-20—Published

2003-01-08—Filed