FIELD: microelectronics.
SUBSTANCE: capacitive pressure pickup comprises silicon substrate provided with a diaphragm inside. The diaphragm is covered in series with epitaxial monocrystalline layer of calcium fluoride, epitaxial layer of silicon, metallized layer, and second silicon plate.
EFFECT: simplified manufacturing and enhanced sensitivity.
1 dwg
Title | Year | Author | Number |
---|---|---|---|
HEAT FLUX SENSOR | 2003 |
|
RU2242728C2 |
INTEGRAL GAUGE OF ABSOLUTE PRESSURE | 2011 |
|
RU2470273C1 |
0 |
|
SU1778576A1 | |
PROCESS OF MANUFACTURE OF MICROMECHANICAL INSTRUMENTS | 1998 |
|
RU2137249C1 |
INTEGRATED MULTICOMPONENT INFRARED PHOTODETECTOR UNIT | 2004 |
|
RU2278446C1 |
MICRO-ELECTROMECHANICAL PRESSURE SENSOR | 2009 |
|
RU2465561C2 |
METHOD FOR PRODUCING CAPACITIVE MICROMECHANICAL INERTIAL SENSOR | 2001 |
|
RU2207658C2 |
PROCESS OF MANUFACTURE OF SEMICONDUCTOR COMPONENTS OF SHF HIGH-POWER TRANSISTOR MICROASSEMBLIES | 1991 |
|
RU2017271C1 |
INTEGRAL ACCELEROMETER SENSITIVE ELEMENT | 2013 |
|
RU2526789C1 |
SHF TRANSISTOR MICROASSEMBLY | 1992 |
|
RU2101803C1 |
Authors
Dates
2005-04-27—Published
2003-06-09—Filed