FIELD: abrasive machinery, particularly devices for bar cutting into plates.
SUBSTANCE: method involves fixing and tightening disc on body; rotating body around its axis; introducing bar into disc orifice for a distance equal to sum of a given plate thickness and width of cut; linear moving bar on cutting blade of the rotary disc; cutting plate from the bar; pulling disc closer to bar; supplying cutting technological means in front of cutting area for cooling cutting blade and behind of cutting area for cleaning cutting blade from products of bar cutting; retracting bar into initial position. Blade pulling is performed during cutting operation by reducing disc dimensions in radial direction by performing uniform blowing gas flow having negative temperature over edge thereof. Blowing is performed along disc perimeter outside cutting area.
EFFECT: increased quality of cut plates due to vibration reduction.
2 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD OF CUTTING OF SEMICONDUCTOR INGOTS INTO PLATES BY DIAMOND CUT-OFF WHEEL WITH INTERNAL CUTTING EDGE | 1995 |
|
RU2109631C1 |
METHOD FOR CUTTING OF BLANKS INTO PLATES | 2002 |
|
RU2220845C1 |
METHOD FOR CUTTING SEMICONDUCTING INGOTS INTO PLATES | 1996 |
|
RU2108225C1 |
METHOD OF CUTTING SILICON SINGLE CRYSTALS | 1998 |
|
RU2155131C2 |
METHOD FOR CUTTING OF PLATES BY DISKS WITH OUTER CUTTING EDGE | 2002 |
|
RU2211142C1 |
METHOD OF TRANSVERSELY SLICING SEMICONDUCTOR MATERIALS | 0 |
|
SU1729764A1 |
ABRASIVE CUTTING CIRCLE | 0 |
|
SU1763162A1 |
DEVICE FOR CUTTING HARD AND BRITTLE MATERIALS | 0 |
|
SU1763205A1 |
METHOD FOR CUTTING BLANKS BY PLATES | 1996 |
|
RU2118594C1 |
METHOD FOR DIAMOND CUTTING OF HARD AND BRITTLE MATERIALS | 0 |
|
SU1699781A1 |
Authors
Dates
2005-05-27—Published
2003-03-28—Filed