HEAT TRANSFER AGENT FOR LOW TEMPERATURE SOLDERING BY DIPPING Russian patent published in 2005 - IPC

FIELD: processes and devices for low-temperature soldering by dipping.

SUBSTANCE: heat transfer agent contains glycerin and activating agent. Hydroxide of alkali or alkali-earth metal or their mixture is used as activating agent being simultaneously stabilizing agent. Heat transfer agent contains components at next relation, mass %: hydroxide of alkali or alkali-earth metal or their mixture, 10 -25; glycerin, the balance. Heat transfer agent is not toxic, thermally stable and keeps its fluxing properties at temperature 150 - 210°C for long time period.

EFFECT: improved properties of heat transfer agent.

2 tbl, 11 ex