FIELD: high-temperature soldering articles such as units of wave-guide equipment of aluminum and its alloys by dipping to melt salts.
SUBSTANCE: paste on base of powder solder of aluminum-silicon system with particle size 100-200 micrometers includes solution of high-molecular compound in isoamyl acetate as organic binder. Paste also contains finely divided powder of aluminum with particle size equal to 20 micrometers or less and(or) pigment aluminum dust. Paste includes next relation of components, mass %: organic binder, 24 - 28; finely divided aluminum powder, 10 - 40; powder solder of aluminum-silicon (eutectics) system, the balance.
EFFECT: enhanced quality of soldered joints due to stable composition and adhesion properties of paste, lowered cost and toxicity of paste.
2 cl, 1 dwg, 2 tbl, 7 ex
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