SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF Russian patent published in 2016 - IPC B23K35/28 C22C21/02 C22C21/10 C22C21/12 

FIELD: metal processing.

SUBSTANCE: invention can be used in producing soldered structures from aluminium and its alloys. Solder contains components in following ratio, wt%: silicon 5-13, copper 1-13.5, zinc 2-10, nickel 0.5-4.5, tin 0.1-0.3, at least one element from a group comprising strontium 0.001-0.2, sodium 0.001-0.2, titanium 0.001-0.1, vanadium 0.001-0.2, at least one element selected from a group of cobalt 0.001-0.8, molybdenum 0.001-0.8; beryllium 0.001-0.1, aluminium - balance. Total content of zinc and copper is not more than 15 wt%, ratio of nickel content to copper ranges from 1:2 to 1:4. During vacuum soldering solder additionally contains magnesium in amount of 0.1-1 wt%.

EFFECT: solder provides high level of strength of soldered joint with possibility of conducting process of soldering at temperatures below 590 °C, which enables to use in soldered structures of most modern structural aluminium alloys.

1 cl, 2 tbl, 3 ex