FIELD: high-temperature dip soldering in melt salts by means of paste like solders of aluminum-silicon eutectic content, mainly soldering precision articles of SHF devices with different thickness of walls.
SUBSTANCE: method comprises steps of preparing powder like solder - paste by mixing powders of pure aluminum in the form of pigment aluminum dust with petal-flake particles, Silumin eutectic solder and solution of copolymer of isobutyl methacrylate and methacrylic acid in isoamyl acetate; providing relation of powder of pigment aluminum dust to powder of Silumin eutectic solder in range (1 - 7) : (2 - 5); performing multi-step heating of soldered articles in air according to predetermined mode; realizing dip soldering in melt salts.
EFFECT: enhanced quality of soldering due to improved adhesion and reduced erosion.
4 cl, 5 dwg, 3 ex
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