FIELD: microelectronics, in particular, materials, used for making products, working in UHF range such as for example flexible electronic circuit boards, flexible circuit cables, flexible circuit inductiveness coils, capacitors and the like.
SUBSTANCE: material has multilayer structure, is made of separate thin films received from same material by similar method of practically even thickness d<80 mcm.
EFFECT: improved manufacturability and low values of tangent of angle of dielectric losses.
2 dwg
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