CHIP CARD MODULE AND METHOD FOR ITS MANUFACTURE, AND ALSO CHIP CARD INCORPORATING SUCH MODULE Russian patent published in 2003 - IPC

FIELD: semiconductor modules and chip cards. SUBSTANCE: chip card module has semiconductor chip electrically connected to metal frame provided with contact pads. Semiconductor chip is electrically connected to contact pads through leads disposed on surface of insulating layer applied to semiconductor chip and presented from the latter. Leads and contact pads can be brought in contact by means of soldered or conducting adhesive joints. In addition invention concerns chip card incorporating proposed model. EFFECT: facilitated manufacture and minimal height of module which makes surface of chip card incorporating it flat and free from bulges and depressions. 10 cl, 3 dwg