FIELD: electroplating processes, possibly electrochemical copper deposition onto steel surfaces of parts without applying additional sub-layer.
SUBSTANCE: electrolyte contains, mol/l: copper compound, 0.1 - 0.5; alkali metal hydroxide, 1.5 -5.0; potassium or sodium nitrate, 0.2 -0.8; propylene glycol, 0.6 - 2.5; hydroxide of tetraalkyl ammonium, 0.0002 -0.0006. Method comprises steps of preparation of parts and realizing electrolytic deposition of copper from such electrolyte at cathode electric current density 0.5 - 3.0 A/dm2 and temperature of electrolyte 20 - 40°C.
EFFECT: improved micro-hardness, increased cohesion of highly uniform coating with base, protection capability of coating due to its lowered porosity, lowered probability of reduction of copper complexes in electrolyte mass.
5 cl, 3 ex, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
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| ELECTROLYTE FOR COPPER-PLATING ALUMINIUM AND ITS ALLOYS | 0 |
|
SU1416529A1 |
