FIELD: production of refractory articles.
SUBSTANCE: high-temperature glue composition comprises, in mass %, fine grinded refractory filler as the base, 1.0-10 of carbon-containing material, 5.0-15.0 of powder-like phenol binder, and 15-21.2 of ethyleneglycol. The composition could also comprise , in mass %, 0.1-5 of boron carbide and/or nitride, 0.1-5 of organic or inorganic micro-reinforcing fiber filler, and 0.5-10 of pitch.
EFFECT: enhanced high-temperature strength.
4 cl, 1 tbl
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Authors
Dates
2006-11-27—Published
2004-08-09—Filed