FIELD: sealing composition and materials.
SUBSTANCE: invention relates to a method for preparing a composition designated for electric sealing and contacting wave guide tracts used in electronic engineering industry and instrument making. The composition comprises the following ratio of components, mas. p. p.: epoxy diane resin ED-20, 30-40; silver powder of the grade pure, 90-110; polyethylene polyamine of the grade A, 3.5-5.5, and cyclohexanone as a solvent, 40-70. Invention provides enhancing moisture resistance under condition of 98% of moisture at temperature +40°C for 12 days, increasing adhesion and providing impact resistance to temperature effect in the range from -60°C to +85°C.
EFFECT: improved and enhanced properties of composition.
2 tbl, 3 ex
Title | Year | Author | Number |
---|---|---|---|
GLUING CURRENT-CONDUCTING COMPOSITION | 2006 |
|
RU2304159C1 |
CURRENT-CONDUCTING ADHESIVE COMPOSITION | 2009 |
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RU2408642C1 |
FOAM COMPOUND COMPOSITION | 2012 |
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RU2472820C1 |
EPOXIDE COMPOUND AND METHOD OF PROTECTING CERAMIC MULTILAYER CONDENSERS USING THIS COMPOUND | 1994 |
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COLD SETTING COMPOUND | 2012 |
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RU2481373C1 |
EPOXIDE MOULDING COMPOSITION FOR ARMORING OF INSERT CHARGE FROM MIX SOLID PROPELLANT | 2007 |
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RU2377229C2 |
COMPOUND FOR FLOOR COVERING | 0 |
|
SU1735249A1 |
CURRENT-CONDUCTING ADHESIVE COMPOSITION | 2005 |
|
RU2308105C1 |
Authors
Dates
2007-01-10—Published
2005-12-12—Filed