HONEYCOMB STRUCTURE, ADHESIVE AND SOLDER APPLYING METHOD FOR MAKING SUCH HONEYCOMB STRUCTURE Russian patent published in 2007 - IPC B23K1/00 F01N3/28 

Abstract RU 2291767 C2

FIELD: manufacture of honeycomb structures, for example for making carriers of catalytic neutralizers in exhaust gas discharge systems.

SUBSTANCE: mean diameter of particles of powder solder is selected in such a way that absolute value of said diameter is no more than 15% of corrugation height. Minimum width of adhesive stripe is determined depending upon height of corrugations and diameter of solder particles with use of given equation. Adhesive in the form of stripes of predetermined width is applied at least on part of top portions of corrugations of profiled foil sheet. Solder is applied onto honeycomb structure. Non-detachable joint of foil sheets forming honeycomb structure features sufficiently high operational reliability at condition of heat and dynamic loads.

EFFECT: improved operational reliability of honeycomb structure.

19 cl, 5 dwg

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RU 2 291 767 C2

Authors

Brjukk Rol'F

Al'Tkhefer Kajt

Khodgson Jan

Rolle Arndt-Udo

Dates

2007-01-20Published

2002-12-20Filed