FIELD: process engineering.
SUBSTANCE: invention relates to process gas treatment in unit intended for soldering by flowed solder. Proposed device comprises vessel with its top accommodating at least one adapter layer and bottom to house fluid, gas feed line to process gas into vessel top and to force it through wetted adapter layer, gad discharge line and device to feed gas into vessel top. Proposed method consists in that process gas is, first, fed into contact with fluid and, then it is forced through at least one adapter layer.
EFFECT: reliable removal of bypass products from process gas, reduced costs.
27 cl, 3 dwg
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