FIELD: automatics, namely a method for manufacturing an electronic module.
SUBSTANCE: the module, manufactured in accordance with claimed method, includes a set of two isolation plates (2,9) and electronic component (3). First (2) isolation plate forms one of module surfaces and has at least one window (4), wherein an electronic component (3) is positioned. One of surfaces of aforementioned element (3) is at the same level as the surface of aforementioned first plate (2), and is accessible on external surface of the module. Second (9) isolation plate forms the other surface of the module. The module includes adhesive film (5), which covers the area with at least a contour of window (4) of element (3) and is positioned between first (2) and second (9) plates. The module may also include at least one electronic circuit (6), positioned between two isolation plates (2,9) and connected to element (3) by means of conductive contact areas (13), positioned on internal side of element (3).
EFFECT: reduced percentage of discards, reduced manufacturing costs due to increased speed of manufacture without worsening of module quality.
2 cl, 9 dwg
