METHOD FOR BUILDING A COMPONENT INTO A BASE AND FOR SETTING UP ELECTRIC CONTACT WITH COMPONENT Russian patent published in 2007 - IPC H05K1/18 

FIELD: electric engineering.

SUBSTANCE: in accordance to method, semiconductor components, forming a part of electronic circuit, or at least some of such components, are built into base, for example, electronic board during its manufacture. Therefore, structure of base is to a certain degree formed around the semiconductor component. In accordance to invention, at least one conductive pattern and apertures for semiconductor components are formed in the base. After that semiconductor components are placed in apertures, combining these with conductive pattern. Semiconductor components are connected to structure of base, in which one or more conductive patterns are made, so that at least one conductive pattern forms electric contact with contact areas on the surface of semiconductor component.

EFFECT: increased reliability.

2 cl, 23 dwg