METHOD OF INTEGRATION OF COMPONENTS TO PLATE-BASE Russian patent published in 2008 - IPC H05K3/30 H05K1/18 

FIELD: electrotechnics.

SUBSTANCE: invention is related to the method, according to which semiconductor elements, forming the part of electronic circuit or at least some of its components, of integration to the plate-base, for example to the printing board in the process of its production. The effect of the invention is achieved by making through-holes in the plate-base for semiconductor components, together with that these holes move between the first and the second surfaces of the plate-base. After creating these holes on the second surface structure plate-base one lays on the plastic foil, which covers the through-holes for semiconducting elements from the side of the second surface structure plates-base. Before hardening of he plastic foil or after its partial hardening the semiconductor elements are cut in from the side of the first surface. Semiconductor elements are pressed down to the plastic foil after that they are being glued to it. After that the final hardening of the plastic foil is carried out.

EFFECT: creation of the method, by which packageless microcircuit are inbuilt safely and economically to the plate-base.

24 cl, 23 dwg