FIELD: microelectronics, production of electronic devices and integrated circuits.
SUBSTANCE: proposed surface wiring instrument has metalized transfer holes and wiring pads on its bottom end as well as conducting pattern components on its top end with one or more electronic components located inside package formed by sealing compound being connected to them; contact pads, metalized transfer holes, and sections of respective components of conducting pattern abutting against transfer hole are covered with continuous layer of tinned material that completely fills up transfer holes to form monolithic jumpers one or more of whose edges can emerge onto side edges of instrument for surface wiring.
EFFECT: enhanced reliability and reduced size of instrument.
1 cl, 5 dwg
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