FIELD: microwave electronic devices. SUBSTANCE: device has dielectric circuit board 1, which is metal coated on both sides and carries metal pattern 2 on face side. In addition device has wiring plates 3 which are located on current- and heat-conducting elements 4 which are located in holes 5 of circuit board 1. In addition device has heat-removing base 6, which is connected to metal coating 7 on back side. In addition device has electronic units 8 which have no housing and are mounted on wiring plates 3 by means of compound 9. Wiring plates are located in metal-coated recesses 10. EFFECT: improved electronic characteristics, increased heat removal, decreased weight and size, increased good-to-bad ration.
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