METHOD FOR MANUFACTURING CERAMIC BOARDS FOR MICROWAVE MONOLITHIC INTEGRATED CIRCUITS Russian patent published in 2023 - IPC C04B41/88 C04B41/90 H05K3/42 H05K3/06 

FIELD: ceramic boards.

SUBSTANCE: invention is related to the technology of manufacturing ceramic boards for ultra-high-frequency monolithic integrated circuits (microwave MICs) and can be used for the production of microwave MICs of increased power. A method for manufacturing a ceramic board involves forming a metallization pattern on the surfaces of the board and filling via holes with a silver-containing composition. The surfaces of the board and the surfaces of the holes are metallized by vacuum deposition of copper, a topological metallization pattern is formed, a spacer of silver-copper eutectic solder is placed above the areas with the holes with a thickness that provides a volume of solder that is at least 1.5 times greater than the volume of the board metallization coating, including the volume of the holes, the solder is melted at a temperature of 820-830°C in a reducing environment at a pressing pressure of the solder pad to the metallization of 0.1-0.2 kgf/cm².

EFFECT: ensuring effective heat removal from active functional elements, as well as minimal dielectric losses, characterized by the tangent (tgδ) of the dielectric loss of the board material, minimal inductance in the common electrode and low microwave energy losses.

1 cl, 5 dwg, 1 tbl