TIN BASED SOLDER FOR LOW TEMPERATURE SOLDERING Russian patent published in 2008 - IPC B23K35/26 C22C13/02 

FIELD: technological processes.

SUBSTANCE: solder can be used for low temperature soldering of objects from coloured and ferrous metals, particularly in the production of electrical and radio equipment. The solder contains the following components, in the given mass.%: antimony 0.6-1.2, copper 0.2-1.1, nickel 0.1-0.5, cerium 0.01-0.1, bismuth 1.0-5.0, lead 0.15-1.8, tin constitutes the rest.

EFFECT: increased durability of soldered joints; reduced defects when soldering and considerable increase in the life time and reliability of the soldered joints.

3 tbl, 3 ex