LEAD FREE SOLDER Russian patent published in 2005 - IPC

Abstract RU 2254971 C2

FIELD: manufacture of joints by means of low temperature soldering, particularly in microelectronics.

SUBSTANCE: solder includes next relation of components, mass %: tin, 76 -96; copper, 0.2 - 0.5; silver, 2.5 - 4.5; indium, more than 0 - 12.0; bismuth, 0.5 - 5.0; Sb, 0.01 - 2. Solder features melting temperature range 175 - 210°C quite satisfactory for making electronic devices.

EFFECT: high ultimate strength and fatigue strength of solder that may easily wet metallic substrates.

1 dwg

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RU 2 254 971 C2

Authors

Meddl Ehlan Lenard

Uon Dzhenni S.

Guo Shen'Fen

Dates

2005-06-27—Published

2000-11-16—Filed