METHOD OF RESIST SUBSTRATE MANUFACTURING Russian patent published in 2008 - IPC G03F7/09 H01J37/317 G03F7/20 

Abstract RU 2334261 C2

FIELD: physics; engineering procedures.

SUBSTANCE: resist layer within at least separate areas is adjoined by conductor layer which when resist is electron ray exposed, scatter primary electrons and/or emits secondary electrons. During method realisation resist layer material and conductor layer material, as well as exposure parameters are matched so that resist layer is exposed out of electronic beam exposure area as well, thus relief pattern produced in such a way has relief elements with inclined side ends.

EFFECT: method allows for simple way of relief pattern formation, which elements have gently sloping surface with acute angle of 89° raise; creates gently sloping patterns of hologram-type.

22 cl, 27 dwg, 1 ex

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RU 2 334 261 C2

Authors

Kaule Vittikh

Dates

2008-09-20Published

2004-02-24Filed