FIELD: instrument making.
SUBSTANCE: system for processing solid state devices incorporates head to feed processing fluid onto and withdraw it from the substrate surface, the head approaching the substrate surface to make certain gap there between. The system incorporates the first channel feeding, through the channel, the first fluid medium and the second channel for the second fluid medium, other than the first one, to be fed onto the substrate. The system comprises also the third channel to remove the aforesaid first and second fluids from the substrate surface, the channel being operated at a time with the two channels. The application describes also the method, the device and the head to the effect.
EFFECT: fast and efficient cleaning and drying of solid state substrates along with reducing traces of dirt being formed thereon.
27 cl, 21 dwg
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Authors
Dates
2008-11-10—Published
2003-09-30—Filed