FIELD: metallurgy.
SUBSTANCE: solder includes elements at a following ratio, wt %: silicon 9.0-15.0, magnesium 0.1-1.5, zinc 0.2-10, manganese 0.1-0.15, gallium 0.2-0.4, calcium 0.05-0.1, sodium chloride or potassium chloride 0.05-0.1, aluminium - the rest.
EFFECT: upgraded quality and hardness of soldered connection.
4 ex
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR MANUFACTURE OF MICROCRYSTALLINE ALUMINIUM SOLDER | 2007 |
|
RU2343059C2 |
0 |
|
SU1780966A1 | |
SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
METHOD FOR CONNECTION OF TWO SOLID-STATE SAMPLES | 2006 |
|
RU2342231C2 |
PRODUCTION OF BIMETAL PRECIOUS METAL ROLLED STOCK | 2014 |
|
RU2562191C1 |
SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF | 2014 |
|
RU2596535C2 |
0 |
|
SU1779518A1 | |
SOLDER FOR SOLDERING ALUMINIUM AND ITS ALLOYS | 2016 |
|
RU2622477C1 |
SOLDER FOR SOLDERING HETEROGENEOUS METALS | 0 |
|
SU1574415A1 |
AMORPHOUS SOLDER FOR STEEL AND ALLOY SOLDERING | 0 |
|
SU1816611A1 |
Authors
Dates
2008-11-20—Published
2007-01-09—Filed