FOIL-COATED MYCROCRYSTALLIC SOLDER ON ALUMINIUM BASE Russian patent published in 2008 - IPC B23K35/36 B23K1/00 

Abstract RU 2338637 C1

FIELD: metallurgy.

SUBSTANCE: solder includes elements at a following ratio, wt %: silicon 9.0-15.0, magnesium 0.1-1.5, zinc 0.2-10, manganese 0.1-0.15, gallium 0.2-0.4, calcium 0.05-0.1, sodium chloride or potassium chloride 0.05-0.1, aluminium - the rest.

EFFECT: upgraded quality and hardness of soldered connection.

4 ex

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RU 2 338 637 C1

Authors

Averin Fedor Vladimirovich

Markin Vladimir Viktorovich

Smoljakova Ol'Ga Vladimirovna

Losev Sergej Viktorovich

Klimov Sergej Vasil'Evich

Danilova Irina Ivanovna

Dates

2008-11-20Published

2007-01-09Filed