FIELD: technological processes; metallurgy.
SUBSTANCE: at least two layers of metal or alloy that forms solder are preliminarily sputtered on connected surfaces. Every subsequent layer has melting temperature of the previous layer. As the first layer metal is sputtered, which is selected from the following group: titanium, chrome, vanadium. As external layer indium or aluminium or its alloy is sputtered. Materials are connected with their sputtered surfaces and heated with simultaneous action of pressing force for time sufficient for melting of metal layers. Connection is provided that has melting temperature higher than the temperature of solder melting.
EFFECT: expansion of connected materials assortment with simultaneous increase of connection mechanical strength.
4 cl, 10 ex
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