METHOD OF SPUTTERING OF PLASMA COATING (VERSIONS) Russian patent published in 2008 - IPC C23C4/12 

Abstract RU 2338810 C2

FIELD: metallurgy.

SUBSTANCE: method includes implementation of plasmatron, containing hollow cathode, sectioned nozzle-anode and inter-electrode insertion. As plasma generating gases a burning plasma generating mixture is used; it is supplied into periphery region of cavity of the hollow cathode under pressure of 0.5-1 MPa, forming conic flame-plasma jet. A sputtered material is supplied into paraxial region of arc, having temperature of 20000 - 50000 K and current strength of 150 - 1000 A at amount facilitating cooling of high temperature region of arc to 5000 - 6000 K. Sputtered particles are accelerated to the rate of 1-3 km/s at rotation of anode region of arc along the area of anode nozzle sections with angular rate of not less, than 6.0 rev/min. According to the second version of the method sputtered particles are accelerated to the rate of from 3 to 10 km/sec at rotation of anode region of arc along the surface of sections of the nozzle-anode with angular speed not less, than 6.0 rev/min generating plasma thin film coating of 0.1-20 mcm thickness.

EFFECT: upgraded quality, adhesion and strength of coating, as well as upgraded efficiency of sputtering.

2 cl, 1 dwg

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RU 2 338 810 C2

Authors

Gizatullin Salavat Anatol'Evich

Galimov Ehngel' Rafikovich

Dautov Gali Junusovich

Khaziev Rinat Masnavievich

Gizatullin Radik Anatol'Evich

Beljaev Aleksej Vital'Evich

Dates

2008-11-20Published

2006-11-16Filed