REPAIR-SOLDERING HEAD AND METHODS REALISED BY MEANS OF THIS HEAD Russian patent published in 2008 - IPC B23K3/00 B23K3/06 B23K1/18 

FIELD: technological processes, tool.

SUBSTANCE: invention may be used for replacement of printed circuit boards components, in particular, for components soldering or unsoldering, for removal of residual solder, for servicing of installation place. Repair-soldering head has receiving element for component subject to soldering or unsoldering with supply channel for heat-transmitting medium and return channel for its discharge. Mentioned channels may be formed with internal tube and external tube that surrounds it. As heat-transmitting medium, for instance, liquid solder may be used, which is sent through supply pipeline to component of the circuit and flows back again through return channels. Component removal is done by means of vacuum connection, which provides suction of component to receiving element.

EFFECT: reduction of time required for replacement of printed circuit board components.

11 cl, 3 dwg