METHOD FOR MOUNTING MICRO-ASSEMBLIES IN A MODULE PACKAGE Russian patent published in 2018 - IPC H05K7/02 H05K3/30 H01L21/58 

FIELD: electronics.

SUBSTANCE: invention relates to methods for mounting micro-assemblies in electronic module packages and can be used in the assembly of super-high frequencies (SHF) modules of active phased antenna arrays (APAA). It is achieved by the fact that the installation of micro-assemblies into a package and their subsequent soldering to the package base. Prior to soldering between the micro-assemblies and the package base, solder pads are placed. For mounting micro-assemblies riggings are used. Mountable micro-assemblies of the soldered surface outwards are placed in the mounting seats made at the base of each rigging, and they are fixed there with a vacuum, which is fed to a network of air passages of the rigging through its fitting. Then, the riggings with micro-assemblies are installed in the module package with preliminarily placed solder pads in it, made in accordance with the size of the micro-assemblies, after which the vacuum from the riggings is switched off and gang bending of all installed micro-assemblies is performed. After the completion of the soldering operation, the riggings from the package are removed.

EFFECT: technical result is a reduction in the complexity of the assembly of modules, as well as improving the performance of soldered joints during the micro-assemblies mounting.

3 cl, 5 dwg