LEAD FRAME, WITH SUPPORT HEAT SINK RING, METHOD OF MAKING CASE FOR LIGHT-EMITTING DIODE WITH ITS USE AND CASE FOR LIGHT-EMITTING DIODE, MADE USING THIS METHOD Russian patent published in 2009 - IPC H01L33/00 

FIELD: physics.

SUBSTANCE: proposed here are two versions of light-emitting diodes in a case. According to one version, the light-emitting diode has a support heat sink ring, with an opening. A heat sink is put into the opening of the support heat sink ring. The heat sink has an upper surface which stretches above the upper surface of the support heat sink ring. The crystal of the light-emitting diode is on the upper surface of the heat sink. The base of the case supports the heat sink and the support heat sink ring. The base of the case has an opening, which opens the upper surface of the heat sink. The first set of leads stretches out from the first side of the base of the case. Each of the leads in the first set has a near end, which is close to the supporting heat sink ring. Each near end of the leads in the first set is separated from the support heat sink ring and from each other. There is a second set of leads, which stretches out from the second side of the base of the case. Each of the leads in the second set has a near end, which is close to the support heat sink ring. Each near end of the leads in the second set is separated from the support heat sink ring and from each other. The upper surface of the heat sink stretches, at least, partially above the upper surface of the base of the case such that, the light-emitting diode on the upper surface of the heat sink, at least partially lies above the upper surface of the base of the case. Proposal is also given of the method of making a light-emitting diode in a case. The light-emitting diode made in accordance with the invention, is structurally stable and has good heat dissipation.

EFFECT: design of a light-emitting diode, which is structurally stable and has good heat dissipation.

19 cl, 20 dwg