FIELD: electricity.
SUBSTANCE: invention relates to a chemical mechanical polishing composition for treating an outer sapphire surface and a method for polishing a sapphire substrate. Disclosed is a method for polishing an outer sapphire substrate using a polishing slurry, comprising as starting components: colloidal silica as an abrasive, where colloidal silica has a negative surface charge and wherein the colloidal silica has a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm and a second particle size maximum between 75 and 200 nm. Polishing slurry may further comprise a pesticide, or a nonionic defoaming agent, or pH regulator.
EFFECT: invention provides fast of leveling the surface of sapphire plates (substrates), resulting in the removal of surface defects, scratches, and damaged layers.
12 cl, 2 tbl
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Authors
Dates
2018-07-13—Published
2014-08-19—Filed