FIELD: chemistry.
SUBSTANCE: slurry contains, wt %: colloidal silica stabilized with sodium oxide with a particle size of 75-80 nm in terms of silica - 39-40; sodium chloride - 1.2-1.4; calcined soda - 1.6-1.8 and water - up to 100.
EFFECT: increased use time for the polishing slurry, high removal rate and low surface roughness.
1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| POLISHING COMPOSITION | 2014 |
|
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RU2082738C1 |
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|
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|
RU2356926C2 |
