FIELD: chemistry.
SUBSTANCE: invention refers to transparent sealant material. Substance of the invention: transparent sealant compound containing curing resin chosen of the group including epoxy resins, acrylate resins, polyimide resins, fluorocarbon resins, fluorine resins, benzcyclobutene resins, bismaleimide triazine resins, fluorinated polyallyl esters, polyamide resins, polyimidoamide resins, phenolresol resins, aromatic polyester resins, polyphenylester resins and polydimethylsiloxane resins mixed with a solvent and a filling agent of colloid silicon dioxide has been functionalised by at least one organoalkoxysilane, where said resin forms transparent resin forming thermoset resin of low thermal expansion coefficient and high vitrification temperature exceeding 180°C. There is also provided production process of transparent sealant compound and a solid-state system based on said compound.
EFFECT: production of sealant characterised by improved transparency, low thermal expansion coefficient and high vitrification temperature.
10 cl, 3 tbl
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Authors
Dates
2009-06-10—Published
2004-08-03—Filed