FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of creating small-sized micromodules on a flexible board containing several LSIs. Summary of the invention: micromodule comprises a flexible board provided with metallized interlayer via-holes and mounted on it with open-body LSI crystals with projections. Metallized interlayer via-holes have the form of a convex curved surface of variable cross section along the length, with curved contact pads on the top and bottom surfaces of the flexible board, are made with a reduction of the section from the contact pad on the upper and lower surface to the middle plane of the board.
EFFECT: technical result of the invention is increased mounting density and reliability of interlayer connections of small-sized micromodules.
1 cl, 1 dwg
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